3M™ Scotch-Weld™ Void Filling Compound 3500-2 B/A

3M™ Scotch-Weld™ Void Filling Compound EC-3500 B/A is a two-part high temperature curing core splicing material for reinforcing honeycomb core and filling mismatch areas. Scotch-Weld™ EC-3500 has low density and long work life.

Benefits

• Provides high performance from -55°C to 175°C
• Compatibility with metal and non-metal
• Provides an excellent chemical resistance
• Cures from 120°C to 175°C in one hour
• Room temperature storage
• Low cured density
• Long work life

Uses

• Ideal for honeycomb sandwich construction
• Honeycomb splicing and reinforcement
• Mismatch areas filling

Specification

Brand: Scotch-Weld™

Base: Epoxy

Colour: Grey

Cure cycle: 1 hour from 120°C to 175°C with 2-5°C/minute heat-up rate

Worklife: 5 days at 15-30°C

Country of Origin: USA

Dry Ice Shipping Required: No