3M™ Scotch-Weld™ Void Filling Compound EC-3500 B/A
3M™ Scotch-Weld™ Void Filling Compound EC-3500 B/A is a two-part high temperature curing core splicing material for reinforcing honeycomb core and filling mismatch areas. Scotch-Weld™ EC-3500 has low density and long work life.
Benefits
- Provides high performance from -55°C to + 175°C
- Compatibility with metal and non-metal
- Provides an excellent chemical resistance
- Cures from 120°C to 175°C in one hour
- Room temperature storage
- Low cured density
- Long work life
Uses
- Ideal for honeycomb sandwich construction
- Honeycomb splicing and reinforcement
- Mismatch areas filling
Specification
Brand: Scotch-Weld™
Base: Epoxy
Colour: Off-white
Cure cycle: 1 hour from 120°C to 175°C with 2-5°C/minute heat-up rate
Worklife: 5 days at 15-30°C
Country of Origin: USA
Dry Ice Shipping Required: No
